BOILPEAK® ELASTOMERS
Advanced Plasma-Resistant Sealing Solutions
Engineered for oxygen plasma, aggressive chemistries, and extreme process environments, Boilpeak sealing solutions provide reliable performance across dry etch, wet etch, and cleaning applications.
Key Advantages:
Custom materials with superior chemical and plasma resistance
Specialized solutions for dry etch and wet processing equipment
Reduced particle generation and contamination risks
Enhanced process stability and improved wafer yields
Reliable Sealing Solutions for Demanding Environments
Our advanced FFKM materials are specifically engineered to withstand aggressive plasma, reactive chemicals, and temperatures exceeding 327°C in semiconductor manufacturing environments. Designed for critical process applications, they deliver superior sealing performance, reduced particle generation, and extended service life.
Key Advantages:
Exceptional resistance to plasma, corrosive gases, and aggressive process chemistries
Long-lasting performance under extreme temperatures and high-vacuum conditions
Reduced contamination risks and enhanced process stability
Increased equipment uptime and improved wafer yield
Engineered for reliable performance in critical semiconductor applications
UThot™ KH Series
UThot™ KH Series FFKM Compounds are engineered for extreme semiconductor processing environments, offering exceptional resistance to plasma, aggressive chemicals, high temperatures, and vacuum conditions. Designed to maximize equipment reliability and process stability, the KH Series delivers long-lasting sealing performance, low particle generation, and extended service life in critical applications.
UTchem™ KR Series
UTchem™ KR Series FFKM Compounds are engineered for harsh chemical environments, delivering outstanding resistance to acids, alkalis, solvents, and aggressive process media. Designed for maximum reliability and extended service life, they provide superior sealing performance in chemical processing, semiconductor, pharmaceutical, and other critical industrial applications.
UTpure™ KS Series
UTpure™ KS Series FFKM Compounds are engineered for ultra-high purity environments where contamination control is critical. Featuring low particle generation, low outgassing, and excellent resistance to plasma, chemicals, and high temperatures, the KS Series provides reliable sealing performance for advanced semiconductor and high-purity process applications.
4 Main Semiconductor Manufacturing Processes
Deposition
Depositing conductive, insulating, or semiconductor films onto the wafer surface to create the required device structures.
Typical Technologies:
CVD (Chemical Vapor Deposition)
ALD (Atomic Layer Deposition)
PVD (Physical Vapor Deposition)
Epitaxy
Sealing Requirements:
High-temperature resistance
Vacuum compatibility
Low outgassing
Plasma resistance
Lithography
Transferring circuit patterns onto the wafer using photoresist and advanced exposure systems.
Typical Technologies:
DUV Lithography
EUV Lithography
Photoresist Coating & Developing
Sealing Requirements:
Chemical resistance
Ultra-clean performance
Low particle generation
Etching
Removing selected materials from the wafer to create precise circuit structures.
Typical Technologies:
Dry Etching (Plasma Etch)
Reactive Ion Etching (RIE)
Wet Etching
Sealing Requirements:
Extreme plasma resistance
Aggressive chemical resistance
Low contamination
Long service life
Cleaning & Chemical Processing
Removing contaminants and residues to ensure process integrity and yield.
Typical Technologies:
Wet Cleaning
Chemical Mechanical Polishing (CMP)
Surface Treatment
Chemical Processing
Sealing Requirements:
Acid and solvent resistance
High purity materials
Low extractables
Corrosion resistance