Semiconductor manufacturing environments demand ultra-clean, chemically resistant, and thermally stable O-Ring materials. Seals used in front-end and back-end processes must meet strict requirements for low outgassing, particle generation, and plasma resistance—ensuring process purity and yield integrity.
|
Material |
Temperature Range (°C) |
Key Properties |
Applications |
|
FFKM |
-15 to +327 |
Exceptional chemical, plasma, and thermal resistance |
Plasma etching, CVD/PVD, wet etch, resist strippers |
|
Peroxide-cured FKM |
-20 to +200 |
Good solvent resistance, improved cleanliness |
Back-end packaging, vacuum handling |
|
Modified PTFE (filled or energized) |
-200 to +260 |
Non-elastomeric, chemically inert, low particle generation |
Wafer handling, CMP equipment |
|
High-purity EPDM |
-50 to +150 |
Excellent resistance to acids, DI water, ozone |
Wet cleaning, etch baths, gas lines |
|
Silicone (low-bleed, low-volatility) |
-60 to +230 |
Flexible, clean, and thermally stable |
Load locks, vacuum seals, photolithography |
